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新思科技3DIO全方位解决方案,推进2.5D/3D封装技术
对高性能计算、下一代服务器和AI加速器的需求迅速增长,增加了处理更大工作负载的需求。这种不断增加的复杂性带来了两个主要挑战:可制造性和成本。从制造角度来看,这些处理引擎正接近光刻机可以蚀刻的光罩的最大尺寸;而随着芯片尺寸的增大和相应 ...
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