To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...

NuTool Inc. today introduced a copper chemical mechanical planarization (CMP) process using fixed abrasive for copper polish on Ultra Low-k dielectrics. The polishing process, which demonstrated a ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/n63tp6/cmp_consumables) has announced the addition of the "CMP Consumables ...