New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, January 20, 2026 /EINPresswire.com/ ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...

DENVER--(BUSINESS WIRE)--Advanced Energy (Nasdaq: AEIS) today announced it will introduce the highly-flexible iHP intelligent configurable power supply for the semiconductor industry across a wide ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) ...

The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that ...