- Paper Presented at 14th IEEE CPMT Symposium Japan (ICSJ 2025) - TOKYO, Nov. 13, 2025 /PRNewswire/ -- On November 13, 2025, Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...

ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...

Industry-leaders will create hub for R&D with prototype production line for 515 x 510mm panel-level organic interposers Resonac will establish an "Advanced Panel Level Interposer Center (APLIC)" as ...

With the increasing demand in computation and low latency, the semiconductor industry is transitioning from 2.5D packaging (e.g., B200 and MI350) to next-generation 3D packaging architecture. However, ...

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 ...

Professor Joongoo Kang's team from the Department of Physics and Chemistry at DGIST (President Kunwoo Lee) and Professor Sohee Jeong's team from the Department of Energy Science at Sungkyunkwan ...