Abstract: The analysis of the small-signal stability of conventional power systems is well established, but for inverter based microgrids there is a need to establish how circuit and control features ...

2025 IEEE International Solid-State Circuits Conference (ISSCC) Location: San Francisco, CA, USA 2024 IEEE International Solid-State Circuits Conference (ISSCC) Location: San Francisco, CA, USA 2023 ...

Abstract: Cascaded H-bridge multilevel converter (CHMC) is a promising topology for flexible ac transmission systems such as static synchronous compensator (STATCOM) applications. Attention was drawn ...

Abstract: Self-driving vehicles are a maturing technology with the potential to reshape mobility by enhancing the safety, accessibility, efficiency, and convenience of automotive transportation.

Abstract: Event cameras are bio-inspired sensors that differ from conventional frame cameras: Instead of capturing images at a fixed rate, they asynchronously measure per-pixel brightness changes, and ...

Abstract: Novel computational and statistical prediction methods such as the support vector machine are becoming increasingly popular in remote-sensing applications and need to be compared to more ...

Abstract: Many modern object detectors demonstrate outstanding performances by using the mechanism of looking and thinking twice. In this paper, we explore this mechanism in the backbone design for ...

Abstract: We propose an approach to estimate the 6DOF pose of a satellite, relative to a canonical pose, from a single image. Such a problem is crucial in many space proximity operations, such as ...

Abstract: Parallel control and management have been proposed as a new mechanism for conducting operations of complex systems, especially those that involved complexity issues of both engineering and ...

Abstract: Recent studies have shown remarkable success in image-to-image translation for two domains. However, existing approaches have limited scalability and robustness in handling more than two ...

Abstract: Increasing demand for higher-bandwidth DRAM drive TSV technology development. With the capacity of fine-pitch wide I/O [1], DRAM can be directly integrated on the interposer or host chip and ...

Abstract: High-impedance surfaces (HIS) comprising lossy frequency selective surfaces (FSS) are employed to design thin electromagnetic absorbers. The structure, despite its typical resonant behavior, ...