Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.

There are a number of great libraries out there to allow IoT devices to connect to the internet using a variety of network protocols. For cellular-enabled devices, the choice typically falls on ...

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...