Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...

A recent review article published in Advanced Materials explored the potential of artificial intelligence (AI) and machine learning (ML) in transforming thermoelectric (TE) materials design. The ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

CNC machining benefits, precision engineering, advanced fabrication techniques, tight tolerance manufacturing, custom ...

(Nanowerk Spotlight) The field of drug delivery has long been challenged by the need for precise, targeted methods to transport therapeutic agents within the body. Traditional approaches often ...